Inventor
ZHU JI GUANG
CN6 patents
Patents
6 patentsUS11373949B2Jun 28, 2022
Interconnect structure having metal layers enclosing a dielectric
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations56
US11011410B2May 18, 2021
Substrate having two semiconductor materials on insulator
SEMICONDUCTOR MFG INT SHANGHAI CORP1 citations56
US10553536B2Feb 4, 2020
Method of manufacturing an interconnect structure by forming metal layers in mask openings
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations46
US10347530B2Jul 9, 2019
Method of forming interconnect structure with partial copper plating
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations46
US10262891B2Apr 16, 2019
Substrate having two semiconductor materials on insulator
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations46
US10199478B2Feb 5, 2019
Transistor and method for forming the same
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations38