Inventor

CHANDRASHEKAR ANAND

US52 patents

⚠️ This page may combine multiple inventors who share the name “CHANDRASHEKAR ANAND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANDRASHEKAR ANAND

LAM RES CORP

Feature fill with multi-stage nucleation inhibition

Feature fill with nucleation inhibition

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Void free tungsten fill in different sized features

Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features

Pulsing RF power in etch process to enhance tungsten gapfill performance

Ex situ coating of chamber components for semiconductor processing

Chamber conditioning for remote plasma process

Feature fill with multi-stage nucleation inhibition

Feature fill with multi-stage nucleation inhibition

Feature fill with nucleation inhibition

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Continuous and pulsed RF plasma for etching metals

Ex situ coating of chamber components for semiconductor processing

Pulsing RF power in etch process to enhance tungsten gapfill performance

Void free low stress fill

Feature fill with nucleation inhibition

Tungsten feature fill with inhibition control

Ex situ coating of chamber components for semiconductor processing

Tungsten nitride barrier layer deposition

Fill process optimization using feature scale modeling

Reducing line bending during metal fill process

Reducing line bending during metal fill process

Backside reactive inhibition gas

High step coverage tungsten deposition

Ex situ coating of chamber components for semiconductor processing

NOVELLUS SYSTEMS INC

Tungsten feature fill

Tungsten feature fill

Low tempature tungsten film deposition for small critical dimension contacts and interconnects

Tungsten feature fill with nucleation inhibition

Tungsten feature fill

Depositing tungsten into high aspect ratio features

Tungsten feature fill

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Low temperature tungsten film deposition for small critical dimension contacts and interconnects

Method for forming tungsten film having low resistivity, low roughness and high reflectivity

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

CHANDRASHEKAR ANAND

Depositing tungsten into high aspect ratio features

Thinning tungsten layer after through silicon via filling

Depositing tungsten into high aspect ratio features

Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics

Depositing tungsten into high aspect ratio features

Method for depositing tungsten film having low resistivity, low roughness and high reflectivity

Method for depositing tungsten film having low resistivity, low roughness and high reflectivity

Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics

CHEN FENG

Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects

JENG ESTHER

Systems and methods for controlling etch selectivity of various materials