Inventor
PICKETT CHRISTOPHER M
US9 patents
Patents
9 patentsUS6080932AJun 27, 2000
Semiconductor package assemblies with moisture vents
TESSERA INC135 citations98
US6002168ADec 14, 1999
Microelectronic component with rigid interposer
TESSERA INC204 citations98
US6384475B1May 7, 2002
Lead formation using grids
TESSERA INC51 citations96
US6361959B1Mar 26, 2002
Microelectronic unit forming methods and materials
TESSERA INC65 citations96
US6358780B1Mar 19, 2002
Semiconductor package assemblies with moisture vents and methods of making same
TESSERA INC57 citations96
US6737265B2May 18, 2004
Microelectronic unit forming methods and materials
TESSERA INC29 citations92
US6208025B1Mar 27, 2001
Microelectronic component with rigid interposer
TESSERA INC36 citations92
US6063648AMay 16, 2000
Lead formation usings grids
TESSERA INC44 citations92
US6627478B2Sep 30, 2003
Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction
TESSERA INC3 citations62