Inventor
MATHAD GANGADHARA S
US22 patents
⚠️ This page may combine multiple inventors who share the name “MATHAD GANGADHARA S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS5391510AFeb 21, 1995
Formation of self-aligned metal gate FETs using a benignant removable gate material during high temperature steps
IBM394 citations99
US4741799AMay 3, 1988
Anisotropic silicon etching in fluorinated plasma
IBM65 citations96
US4671849AJun 9, 1987
Method for control of etch profile
IBM93 citations96
US4602981AJul 29, 1986
Monitoring technique for plasma etching
IBM76 citations96
US4534816AAug 13, 1985
Single wafer plasma etch reactor
IBM458 citations96
US6284666B1Sep 4, 2001
Method of reducing RIE lag for deep trench silicon etching
IBM87 citations95
US4478677AOct 23, 1984
Laser induced dry etching of vias in glass with non-contact masking
IBM73 citations95
US4490211ADec 25, 1984
Laser induced chemical etching of metals with excimer lasers
IBM73 citations94
US4617730AOct 21, 1986
Method of fabricating a chip interposer
IBM118 citations93
US6743727B2Jun 1, 2004
Method of etching high aspect ratio openings
IBM38 citations92
US4511430AApr 16, 1985
Control of etch rate ratio of SiO2 /photoresist for quartz planarization etch back process
IBM45 citations92
US4490210ADec 25, 1984
Laser induced dry chemical etching of metals
IBM38 citations91
US6709917B2Mar 23, 2004
Method to increase the etch rate and depth in high aspect ratio structure
IBM8 citations73
US5258264ANov 2, 1993
Process of forming a dual overhang collimated lift-off stencil with subsequent metal deposition
IBM18 citations73
US5024896AJun 18, 1991
Collimated metal deposition
IBM16 citations73
US7144769B2Dec 5, 2006
Method to achieve increased trench depth, independent of CD as defined by lithography
IBM4 citations62
US6821864B2Nov 23, 2004
Method to achieve increased trench depth, independent of CD as defined by lithography
IBM1 citations51
INFINEON TECHNOLOGIES AG
4 patentsUS6809005B2Oct 26, 2004
Method to fill deep trench structures with void-free polysilicon or silicon
INFINEON TECHNOLOGIES AG51 citations95
US6544838B2Apr 8, 2003
Method of deep trench formation with improved profile control and surface area
INFINEON TECHNOLOGIES AG36 citations92
US6489249B1Dec 3, 2002
Elimination/reduction of black silicon in DT etch
INFINEON TECHNOLOGIES AG37 citations92
US6687014B2Feb 3, 2004
Method for monitoring the rate of etching of a semiconductor
INFINEON TECHNOLOGIES AG8 citations72