Inventor
NAGARAJAN RANGANATHAN
SG21 patents
⚠️ This page may combine multiple inventors who share the name “NAGARAJAN RANGANATHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INST OF MICROELECTRONICS
9 patentsUS6846725B2Jan 25, 2005
Wafer-level package for micro-electro-mechanical systems
INST OF MICROELECTRONICS238 citations97
US6717812B1Apr 6, 2004
Apparatus and method for fluid-based cooling of heat-generating devices
INST OF MICROELECTRONICS113 citations95
US6461888B1Oct 8, 2002
Lateral polysilicon beam process
INST OF MICROELECTRONICS70 citations95
US6716570B2Apr 6, 2004
Low temperature resist trimming process
INST OF MICROELECTRONICS32 citations90
US6573154B1Jun 3, 2003
High aspect ratio trench isolation process for surface micromachined sensors and actuators
INST OF MICROELECTRONICS35 citations90
US6662654B2Dec 16, 2003
Z-axis accelerometer
INST OF MICROELECTRONICS21 citations89
US6571628B1Jun 3, 2003
Z-axis accelerometer
INST OF MICROELECTRONICS17 citations89
US6551937B2Apr 22, 2003
Process for device using partial SOI
INST OF MICROELECTRONICS25 citations88
US6858459B2Feb 22, 2005
Method of fabricating micro-mirror switching device
INST OF MICROELECTRONICS3 citations63
AGENCY SCIENCE TECH & RES
8 patentsUS7326629B2Feb 5, 2008
Method of stacking thin substrates by transfer bonding
AGENCY SCIENCE TECH & RES105 citations95
US7230318B2Jun 12, 2007
RF and MMIC stackable micro-modules
AGENCY SCIENCE TECH & RES48 citations94
US7294890B2Nov 13, 2007
Fully salicided (FUSA) MOSFET structure
AGENCY SCIENCE TECH & RES24 citations92
US7183176B2Feb 27, 2007
Method of forming through-wafer interconnects for vertical wafer level packaging
AGENCY SCIENCE TECH & RES57 citations92
US6787456B1Sep 7, 2004
Wafer-level inter-connector formation method
AGENCY SCIENCE TECH & RES21 citations91
US9240362B2Jan 19, 2016
Layer arrangement and a wafer level package comprising the layer arrangement
AGENCY SCIENCE TECH & RES3 citations68
US7592703B2Sep 22, 2009
RF and MMIC stackable micro-modules
AGENCY SCIENCE TECH & RES2 citations61
US7381629B2Jun 3, 2008
Method of forming through-wafer interconnects for vertical wafer level packaging
AGENCY SCIENCE TECH & RES3 citations58