Inventor
HARGROVE MICHAEL
US25 patents
⚠️ This page may combine multiple inventors who share the name “HARGROVE MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
13 patentsUS8048791B2Nov 1, 2011
Method of forming a semiconductor device
GLOBALFOUNDRIES INC122 citations97
US9343300B1May 17, 2016
Methods of forming source/drain regions for a PMOS transistor device with a germanium-containing channel region
GLOBALFOUNDRIES INC45 citations94
US9147730B2Sep 29, 2015
Methods of forming fins for FinFET semiconductor devices and selectively removing some of the fins by performing a cyclical fin cutting process
GLOBALFOUNDRIES INC25 citations93
US7932143B1Apr 26, 2011
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods
GLOBALFOUNDRIES INC32 citations92
US9318342B2Apr 19, 2016
Methods of removing fins for finfet semiconductor devices
GLOBALFOUNDRIES INC16 citations84
US8026539B2Sep 27, 2011
Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same
GLOBALFOUNDRIES INC13 citations84
US9472554B2Oct 18, 2016
Integrated circuits having FinFET semiconductor devices and methods of fabricating the same to resist sub-fin current leakage
GLOBALFOUNDRIES INC6 citations71
US9312387B2Apr 12, 2016
Methods of forming FinFET devices with alternative channel materials
GLOBALFOUNDRIES INC2 citations63
US9236258B2Jan 12, 2016
Methods of forming gate structures for semiconductor devices using a replacement gate technique and the resulting devices
GLOBALFOUNDRIES INC2 citations63
US8373228B2Feb 12, 2013
Semiconductor transistor device structure with back side source/drain contact plugs, and related manufacturing method
GLOBALFOUNDRIES INC2 citations63
US9373721B2Jun 21, 2016
Methods of forming a non-planar ultra-thin body semiconductor device and the resulting devices
GLOBALFOUNDRIES INC0 citations52
US7632727B2Dec 15, 2009
Method of forming stepped recesses for embedded strain elements in a semiconductor device
GLOBALFOUNDRIES INC1 citations52
US9142674B2Sep 22, 2015
FINFET devices having a body contact and methods of forming the same
GLOBALFOUNDRIES INC0 citations50
SEIKO EPSON CORP
6 patentsUS7268645B2Sep 11, 2007
Integrated resonator structure and methods for its manufacture and use
SEIKO EPSON CORP20 citations92
US7598838B2Oct 6, 2009
Variable inductor technique
SEIKO EPSON CORP21 citations89
US7224180B2May 29, 2007
Methods and systems for rise-time improvements in differential signal outputs
SEIKO EPSON CORP14 citations84
US7315438B2Jan 1, 2008
Technique to reduce ESD loading capacitance
SEIKO EPSON CORP19 citations80
US7157926B1Jan 2, 2007
Universal padset concept for high-frequency probing
SEIKO EPSON CORP14 citations77
US7384857B2Jun 10, 2008
Method to fabricate completely isolated silicon regions
SEIKO EPSON CORP3 citations63