P

Inventor

HARGROVE MICHAEL

US25 patents
⚠️ This page may combine multiple inventors who share the name “HARGROVE MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

13 patents
US8048791B2Nov 1, 2011

Method of forming a semiconductor device

GLOBALFOUNDRIES INC122 citations97
US9343300B1May 17, 2016

Methods of forming source/drain regions for a PMOS transistor device with a germanium-containing channel region

GLOBALFOUNDRIES INC45 citations94
US9147730B2Sep 29, 2015

Methods of forming fins for FinFET semiconductor devices and selectively removing some of the fins by performing a cyclical fin cutting process

GLOBALFOUNDRIES INC25 citations93
US7932143B1Apr 26, 2011

Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods

GLOBALFOUNDRIES INC32 citations92
US9318342B2Apr 19, 2016

Methods of removing fins for finfet semiconductor devices

GLOBALFOUNDRIES INC16 citations84
US8026539B2Sep 27, 2011

Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same

GLOBALFOUNDRIES INC13 citations84
US9472554B2Oct 18, 2016

Integrated circuits having FinFET semiconductor devices and methods of fabricating the same to resist sub-fin current leakage

GLOBALFOUNDRIES INC6 citations71
US9312387B2Apr 12, 2016

Methods of forming FinFET devices with alternative channel materials

GLOBALFOUNDRIES INC2 citations63
US9236258B2Jan 12, 2016

Methods of forming gate structures for semiconductor devices using a replacement gate technique and the resulting devices

GLOBALFOUNDRIES INC2 citations63
US8373228B2Feb 12, 2013

Semiconductor transistor device structure with back side source/drain contact plugs, and related manufacturing method

GLOBALFOUNDRIES INC2 citations63
US9373721B2Jun 21, 2016

Methods of forming a non-planar ultra-thin body semiconductor device and the resulting devices

GLOBALFOUNDRIES INC0 citations52
US7632727B2Dec 15, 2009

Method of forming stepped recesses for embedded strain elements in a semiconductor device

GLOBALFOUNDRIES INC1 citations52
US9142674B2Sep 22, 2015

FINFET devices having a body contact and methods of forming the same

GLOBALFOUNDRIES INC0 citations50

SEIKO EPSON CORP

6 patents

YU JIAN

1 patent

YANG BIN

1 patent

LIU YANXIANG

1 patent

IBM

1 patent

PAL ROHIT

1 patent

AMARNATH KULDEEP

1 patent