Inventor
KOBAYASHI HAJIME
JP36 patents
⚠️ This page may combine multiple inventors who share the name “KOBAYASHI HAJIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
9 patentsUS4243994AJan 6, 1981
Liquid recording medium
CANON KK69 citations96
US4069759AJan 24, 1978
Light and heat formation of conductive image printing plate
CANON KK43 citations91
US4273844AJun 16, 1981
Heat-developable photosensitive member for forming electrostatic printing masters
CANON KK11 citations74
US4259424AMar 31, 1981
Heat-developable photosensitive material
CANON KK16 citations74
US4057016ANov 8, 1977
Process for electrostatic printing and apparatus therefor
CANON KK17 citations72
US4036650AJul 19, 1977
Heat developable photosensitive material containing compounds of sulfur
CANON KK10 citations72
US4273845AJun 16, 1981
Heat-developable photosensitive material
CANON KK4 citations63
US4237213ADec 2, 1980
Image forming method
CANON KK5 citations63
US4106409AAug 15, 1978
Electrostatic printing method
CANON KK4 citations63
SONY CORP
5 patentsUS10608049B2Mar 31, 2020
Photoelectric conversion element, image pickup element, laminated image pickup element, and solid-state image pickup device using an organic material having desired optical absorption properties
SONY CORP4 citations71
US11183540B2Nov 23, 2021
Imaging element, method of manufacturing imaging element, and imaging device
SONY CORP0 citations62
US11411051B2Aug 9, 2022
Photoelectric conversion element, image pickup element, laminated image pickup element, and solid-state image pickup device
SONY CORP1 citations60
US11985837B2May 14, 2024
Photoelectric conversion element
SONY CORP0 citations59
US10672837B2Jun 2, 2020
Imaging element, method of manufacturing imaging element, and imaging device
SONY CORP0 citations51
SANYO ELECTRIC CO
4 patentsUS7224066B2May 29, 2007
Bonding material and circuit device using the same
SANYO ELECTRIC CO6 citations72
US8373281B2Feb 12, 2013
Semiconductor module and portable apparatus provided with semiconductor module
SANYO ELECTRIC CO3 citations62
US8344522B2Jan 1, 2013
Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
SANYO ELECTRIC CO0 citations51
US7199468B2Apr 3, 2007
Hybrid integrated circuit device with high melting point brazing material
SANYO ELECTRIC CO0 citations49
PIONEER CORP
3 patentsUS7418391B2Aug 26, 2008
Interactive information providing apparatus, interactive information providing program, and storage medium having stored same
PIONEER CORP13 citations82
US7035798B2Apr 25, 2006
Speech recognition system including speech section detecting section
PIONEER CORP4 citations63
US7813921B2Oct 12, 2010
Speech recognition device and speech recognition method
PIONEER CORP3 citations62