Inventor

MEYER-BERG GEORG

DE62 patents

⚠️ This page may combine multiple inventors who share the name “MEYER-BERG GEORG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEYER-BERG GEORG

INFINEON TECHNOLOGIES AG

Multichip module having a silicon carrier substrate

Chip package with passives

Sensor device having a structure element

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Semiconductor device including an antenna

Ball grid array housing having a cooling foil

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery

Electronic component with sheet-like redistribution structure

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Semiconductor module with interlocked connection

Chip package with embedded passive component

Sensor device and method

Semiconductor module having a coupling substrate, and methods for its production

Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Chip package and a wafer level package

Semiconductor die attach system and method

Attaching chip attach medium to already encapsulated electronic chip

Method of manufacturing a semiconductor component and semiconductor component

Arrangement of multiple power semiconductor chips and method of manufacturing the same

Chip package and a wafer level package

Semiconductor device with encapsulant

Integrated circuit package and a method for manufacturing an integrated circuit package

Packaged nano-structured component and method of making a packaged nano-structured component

Method for fabricating an electronic component

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

Chip arrangement and a method of manufacturing a chip arrangement

Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit

Ball grid array housing having a cooling foil

Chip package with cross-linked thermoplastic dielectric

MEYER-BERG GEORG

Device including a semiconductor chip

Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil

Encapsulated semiconductor chip with external contact pads and manufacturing method thereof

Device including a semiconductor chip and metal foils

Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package

Semiconductor device and manufacturing of the semiconductor device

Semiconductor device package interconnections

Manufacturing of a device including a semiconductor chip

MAHLER JOACHIM

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

ELIAN KLAUS

Semiconductor package with integrated inductor

Sensor device having a porous structure element

INTEL DEUTSCHLAND GMBH

Semiconductor device

Semiconductor device

INTEL CORP

Semiconductor device

Semiconductor device

INFINEON TECHNOLOGIES AUSTRIA

Packaged semiconductor device having an embedded system

THEUSS HORST

Chip assembly