Inventor
HU SHAO-CHUNG
TW14 patents
⚠️ This page may combine multiple inventors who share the name “HU SHAO-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
7 patentsUS6849541B1Feb 1, 2005
Method of fabricating a dual damascene copper wire
UNITED MICROELECTRONICS CORP29 citations92
US7397124B2Jul 8, 2008
Process of metal interconnects
UNITED MICROELECTRONICS CORP8 citations73
US6706140B2Mar 16, 2004
Control system for in-situ feeding back a polish profile
UNITED MICROELECTRONICS CORP9 citations73
US6660627B2Dec 9, 2003
Method for planarization of wafers with high selectivities
UNITED MICROELECTRONICS CORP9 citations73
US6709544B2Mar 23, 2004
Chemical mechanical polishing equipment
UNITED MICROELECTRONICS CORP4 citations62
US7232752B2Jun 19, 2007
Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation
UNITED MICROELECTRONICS CORP0 citations51
US6696361B2Feb 24, 2004
Post-CMP removal of surface contaminants from silicon wafer
UNITED MICROELECTRONICS CORP0 citations40