Inventor
LI CHII-HORNG
TW146 patents
⚠️ This page may combine multiple inventors who share the name “LI CHII-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
34 patentsUS9831116B2Nov 28, 2017
FETS and methods of forming FETs
TAIWAN SEMICONDUCTOR MFG CO LTD23 citations93
US9953875B1Apr 24, 2018
Contact resistance control in epitaxial structures of finFET
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations92
US10734520B2Aug 4, 2020
MOS devices having epitaxy regions with reduced facets
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10510607B1Dec 17, 2019
Semiconductor device convex source/drain region
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9905641B2Feb 27, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9691898B2Jun 27, 2017
Germanium profile for channel strain
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9653574B2May 16, 2017
Selective etching in the formation of epitaxy regions in MOS devices
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9601619B2Mar 21, 2017
MOS devices with non-uniform P-type impurity profile
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9601574B2Mar 21, 2017
V-shaped epitaxially formed semiconductor layer
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9583483B2Feb 28, 2017
Source and drain stressors with recessed top surfaces
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9287398B2Mar 15, 2016
Transistor strain-inducing scheme
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US11004724B2May 11, 2021
FETS and methods of forming FETS
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10483396B1Nov 19, 2019
Interfacial layer between fin and source/drain region
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US10453943B2Oct 22, 2019
FETS and methods of forming FETS
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations83
US10103249B2Oct 16, 2018
FinFET device and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10038095B2Jul 31, 2018
V-shape recess profile for embedded source/drain epitaxy
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations83
US9517539B2Dec 13, 2016
Wafer susceptor with improved thermal characteristics
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10170370B2Jan 1, 2019
Contact resistance control in epitaxial structures of finFET
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations82
US11581425B2Feb 14, 2023
Method for manufacturing semiconductor structure with enlarged volumes of source-drain regions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11011634B2May 18, 2021
Elongated source/drain region structure in finFET device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10879128B2Dec 29, 2020
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10867861B2Dec 15, 2020
Fin field-effect transistor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10854729B2Dec 1, 2020
Method to reduce etch variation using ion implantation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10727342B2Jul 28, 2020
Source and drain stressors with recessed top surfaces
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468482B2Nov 5, 2019
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10084089B2Sep 25, 2018
Source and drain stressors with recessed top surfaces
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10062781B2Aug 28, 2018
MOS devices having epitaxy regions with reduced facets
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9806171B2Oct 31, 2017
Method for making source and drain regions of a MOSFET with embedded germanium-containing layers having different germanium concentration
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9666686B2May 30, 2017
MOS devices having epitaxy regions with reduced facets
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9425287B2Aug 23, 2016
Reducing variation by using combination epitaxy growth
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11948999B2Apr 2, 2024
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11854901B2Dec 26, 2023
Semiconductor method and device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11728208B2Aug 15, 2023
FETS and methods of forming FETS
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11600715B2Mar 7, 2023
FETs and methods of forming FETs
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9287382B1Mar 15, 2016
Structure and method for semiconductor device
TAIWAN SEMICONDUCTOR MFG46 citations98
US9337337B2May 10, 2016
MOS device having source and drain regions with embedded germanium-containing diffusion barrier
TAIWAN SEMICONDUCTOR MFG7 citations84
US9209175B2Dec 8, 2015
MOS devices having epitaxy regions with reduced facets
TAIWAN SEMICONDUCTOR MFG5 citations84
US8946060B2Feb 3, 2015
Methods of manufacturing strained semiconductor devices with facets
TAIWAN SEMICONDUCTOR MFG12 citations84
US8377784B2Feb 19, 2013
Method for fabricating a semiconductor device
TAIWAN SEMICONDUCTOR MFG12 citations84
CHENG YU-HUNG
5 patentsUS9263339B2Feb 16, 2016
Selective etching in the formation of epitaxy regions in MOS devices
CHENG YU-HUNG10 citations84
US8828850B2Sep 9, 2014
Reducing variation by using combination epitaxy growth
CHENG YU-HUNG9 citations84
US8455930B2Jun 4, 2013
Strained semiconductor device with facets
CHENG YU-HUNG12 citations84
US8530316B2Sep 10, 2013
Method for fabricating a semiconductor device
CHENG YU-HUNG6 citations83
US9064688B2Jun 23, 2015
Performing enhanced cleaning in the formation of MOS devices
CHENG YU-HUNG8 citations82
CHEN CHIEN-HAO
2 patentsCHUANG HARRY
1 patentSU LILLY
1 patentLEE YEN-RU
1 patentPENG ERIC
1 patentShowing the top 50 of 146 patents by PatentIndex Score.