Inventor
LETZ TOBIAS
DE10 patents
⚠️ This page may combine multiple inventors who share the name “LETZ TOBIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LETZ TOBIAS
3 patentsUS8193086B2Jun 5, 2012
Local silicidation of via bottoms in metallization systems of semiconductor devices
LETZ TOBIAS8 citations81
US8859398B2Oct 14, 2014
Enhancing adhesion of interlayer dielectric materials of semiconductor devices by suppressing silicide formation at the substrate edge
LETZ TOBIAS3 citations60
US8841140B2Sep 23, 2014
Technique for forming a passivation layer without a terminal metal
LETZ TOBIAS0 citations39
ADVANCED MICRO DEVICES INC
2 patentsUS7924569B2Apr 12, 2011
Semiconductor device comprising an in-chip active heat transfer system
ADVANCED MICRO DEVICES INC13 citations82
US7820536B2Oct 26, 2010
Method for removing a passivation layer prior to depositing a barrier layer in a copper metallization layer
ADVANCED MICRO DEVICES INC3 citations61
GLOBALFOUNDRIES INC
2 patentsUS7879709B2Feb 1, 2011
Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure
GLOBALFOUNDRIES INC6 citations62
US7781343B2Aug 24, 2010
Semiconductor substrate having a protection layer at the substrate back side
GLOBALFOUNDRIES INC6 citations61
FEUSTEL FRANK
2 patentsUS8323989B2Dec 4, 2012
Test system and method of reducing damage in seed layers in metallization systems of semiconductor devices
FEUSTEL FRANK2 citations61
US8673087B2Mar 18, 2014
Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device
FEUSTEL FRANK0 citations50