Inventor

SHAH MILIND P

US8 patents

⚠️ This page may combine multiple inventors who share the name “SHAH MILIND P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

3 patents

US9269681B2Feb 23, 2016

Surface finish on trace for a thermal compression flip chip (TCFC)

QUALCOMM INC4 citations70

US9131634B2Sep 8, 2015

Radio frequency package on package circuit

QUALCOMM INC5 citations69

US8802556B2Aug 12, 2014

Barrier layer on bump and non-wettable coating on trace

QUALCOMM INC2 citations59

BCHIR OMAR J

2 patents

US8742603B2Jun 3, 2014

Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)

BCHIR OMAR J1 citations44

US8703602B2Apr 22, 2014

Selective seed layer treatment for feature plating

BCHIR OMAR J0 citations44

SWEENEY FIFIN

1 patent

US8633597B2Jan 21, 2014

Thermal vias in an integrated circuit package with an embedded die

SWEENEY FIFIN4 citations67

SHAH MILIND P

1 patent

US8847375B2Sep 30, 2014

Microelectromechanical systems embedded in a substrate

SHAH MILIND P4 citations65

KIM JONGHAE

1 patent

US8093982B2Jan 10, 2012

Three dimensional inductor and transformer design methodology of glass technology

KIM JONGHAE5 citations62