Inventor

LEE IN-KYUM

KR2 patents

⚠️ This page may combine multiple inventors who share the name “LEE IN-KYUM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US9087885B2Jul 21, 2015

Method of fabricating semiconductor devices having through-silicon via (TSV) structures

SAMSUNG ELECTRONICS CO LTD6 citations68

JI SANG-WOOK

1 patent

US9437554B2Sep 6, 2016

Semiconductor package having magnetic substance and related equipment

JI SANG-WOOK2 citations51