Inventor
TZOU MING JEN
TW15 patents
⚠️ This page may combine multiple inventors who share the name “TZOU MING JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NANYA PLASTICS CORP
9 patentsUS5858618AJan 12, 1999
Photopolymerizable resinous composition
NANYA PLASTICS CORP33 citations91
US6512075B1Jan 28, 2003
High Tg brominated epoxy resin for glass fiber laminate
NANYA PLASTICS CORP8 citations72
US8957326B2Feb 17, 2015
Composite dual blackened copper foil and method of manufacturing the same
NANYA PLASTICS CORP4 citations65
US7745515B2Jun 29, 2010
Composition of dihydrobenzoxazine resin, epoxy resin(s), novolac resin and curing promoter
NANYA PLASTICS CORP6 citations61
US11588175B2Feb 21, 2023
Electrolytic copper foil
NANYA PLASTICS CORP0 citations60
US9078353B2Jul 7, 2015
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
NANYA PLASTICS CORP3 citations58
US8039560B1Oct 18, 2011
Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof
NANYA PLASTICS CORP0 citations51
US9258900B2Feb 9, 2016
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
NANYA PLASTICS CORP1 citations48
US8362116B2Jan 29, 2013
Low dielectric resin varnish composition for laminates and the preparation thereof
NANYA PLASTICS CORP0 citations34
TZOU MING JEN
3 patentsUS8114508B2Feb 14, 2012
Composition of modified maleic anhydride and epdxy resin
TZOU MING JEN4 citations60
US8329315B2Dec 11, 2012
Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
TZOU MING JEN2 citations56
US9115441B2Aug 25, 2015
Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
TZOU MING JEN0 citations32