Inventor

JO CHA-JEA

KR33 patents

⚠️ This page may combine multiple inventors who share the name “JO CHA-JEA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JO CHA-JEA

SAMSUNG ELECTRONICS CO LTD

Semiconductor package including a rewiring layer with an embedded chip

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip

Semiconductor package including a rewiring layer with an embedded chip

Methods of manufacturing semiconductor packages

Semiconductor package having stacked semiconductor chips

Stack-type semiconductor device having cooling path on its bottom surface

Method of fabricating semiconductor device including a substrate attached to a carrier

Image sensor package

Semiconductor device package and apparatus comprising the same

Image sensor package

Semiconductor package

Semiconductor package and image sensor

Semiconductor package

Method of fabricating an interposer

Semiconductor package

Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip

Substrate structures for image sensor modules and image sensor modules including the same

Image sensor package

Semiconductor package

Interposer, semiconductor package, and method of fabricating interposer

Semiconductor package

Stacked chip package and method for forming the same

Method of fabricating semiconductor multi-chip stack packages

Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate

Photonic integrated circuit

Semiconductor package and method of manufacturing the semiconductor package

Apparatus for stacking semiconductor chips in a semiconductor package

LEE JONG-JOO

Flip chip package

Flip chip package

JO CHA-JEA

Method of manufacturing a chip stack package

CHOI YUN-SEOK

Stacked semiconductor package