Inventor

LOPEZ OSVALDO JORGE

US45 patents

⚠️ This page may combine multiple inventors who share the name “LOPEZ OSVALDO JORGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LOPEZ OSVALDO JORGE

TEXAS INSTRUMENTS INC

Integrating multi-output power converters having vertically stacked semiconductor chips

Integrating multi-output power converters having vertically stacked semiconductor chips

Multi-chip module clips with connector bar

Silicon package for embedded electronic system having stacked semiconductor chips

Thermally enhanced low parasitic power semiconductor package

Semiconductor package with solder standoff

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Plated metal layer in power packages

Power converter monolithically integrating transistors, carrier, and components

Photo-sensitive silicon package embedding self-powered electronic system

Silicon package for embedded semiconductor chip and power converter

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Stress relief structure for flip-chip packaged devices

Plated metal layer in power packages

Packaged electronic device with film isolated power stack

Stress relief for flip-chip packaged devices

Semiconductor package with solder standoff

High I/O density flip-chip QFN

Packaged electronic device with film isolated power stack

Power converter monolithically integrating transistors, carrier, and components

Packaged electronic device with film isolated power stack

Semiconductor device having terminals directly attachable to circuit board

Conductive plate stress reduction feature

Photo-sensitive silicon package embedding self-powered electronic system

Silicon package for embedded semiconductor chip and power converter

Silicon package having electrical functionality by embedded passive components

Silicon package for embedded electronic system having stacked semiconductor chips

Silicon package having electrical functionality by embedded passive components

Multi-die package with multiple heat channels

Integrating multi-output power converters having vertically stacked semiconductor chips

Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer

Integrating multi-output devices having vertically stacked semiconductor chips

Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer

Silicon package for embedded semiconductor chip and power converter

Photo-sensitive silicon package embedding self-powered electronic system

Photo-sensitive silicon package embedding self-powered electronic system

ANADIGICS INC

Low bias current/temperature compensation current mirror for linear power amplifier

Low bias current/temperature compensation current mirror for linear power amplifier

CICLON SEMICONDUCTOR DEVICE CO

Method of making a packaged semiconductor device

Semiconductor die package

AGERE SYSTEMS INC

Metal-oxide-semiconductor device having integrated bias circuit

DENISON MARIE

Power transistor partial current sensing for high precision applications