Inventor
KAI KENSHI
JP11 patents
Patents
11 patentsUS10978371B2Apr 13, 2021
Semiconductor device and method for manufacturing semiconductor device
FUJI ELECTRIC CO LTD2 citations72
US10398036B2Aug 27, 2019
Semiconductor device
FUJI ELECTRIC CO LTD2 citations72
US11337306B2May 17, 2022
Semiconductor device
FUJI ELECTRIC CO LTD0 citations61
US11164846B2Nov 2, 2021
Semiconductor device manufacturing method and soldering support jig
FUJI ELECTRIC CO LTD0 citations61
US10199314B2Feb 5, 2019
Semiconductor device, metal member, and method of manufacturing semiconductor device
FUJI ELECTRIC CO LTD1 citations61
US10405434B2Sep 3, 2019
Mounting jig for semiconductor device
FUJI ELECTRIC CO LTD1 citations59
US9204559B2Dec 1, 2015
Manufacturing method of semiconductor device and mounting jig
FUJI ELECTRIC CO LTD3 citations59
US11069643B2Jul 20, 2021
Semiconductor device manufacturing method
FUJI ELECTRIC CO LTD0 citations50
US10566308B2Feb 18, 2020
Semiconductor device manufacturing method and soldering support jig
FUJI ELECTRIC CO LTD0 citations50
US9877397B2Jan 23, 2018
Mounting jig for semiconductor device
FUJI ELECTRIC CO LTD1 citations48
US10699994B2Jun 30, 2020
Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
FUJI ELECTRIC CO LTD0 citations40