Inventor
LIAO HUNG-KWEI
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LIAO HUNG-KWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PROMOS TECHNOLOGIES INC
5 patentsUS6703273B2Mar 9, 2004
Aggressive capacitor array cell layout for narrow diameter DRAM trench capacitor structures via SOI technology
PROMOS TECHNOLOGIES INC45 citations87
US6734106B2May 11, 2004
Method of buried strap out-diffusion formation by gas phase doping
PROMOS TECHNOLOGIES INC7 citations70
US7535050B2May 19, 2009
Memory structure with high coupling ratio
PROMOS TECHNOLOGIES INC0 citations51
US7485917B2Feb 3, 2009
Split gate flash memory cell and fabrication method thereof
PROMOS TECHNOLOGIES INC1 citations44
US7427569B2Sep 23, 2008
Metal etching process and rework method thereof
PROMOS TECHNOLOGIES INC1 citations44
POWERCHIP SEMICONDUCTOR MFG CORP
5 patentsUS11915969B2Feb 27, 2024
Semiconductor structure and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations56
US11171217B1Nov 9, 2021
Memory structure and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations54
US11189715B2Nov 30, 2021
Semiconductor device and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations45
US10777652B2Sep 15, 2020
Semiconductor device and manufacturing method thereof
POWERCHIP SEMICONDUCTOR MFG CORP0 citations44
US10784259B2Sep 22, 2020
Semiconductor device and method of manufacturing the same
POWERCHIP SEMICONDUCTOR MFG CORP0 citations33