P

Inventor

PARK KI-YEON

KR45 patents
⚠️ This page may combine multiple inventors who share the name “PARK KI-YEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

38 patents
US7151039B2Dec 19, 2006

Method of forming oxide layer using atomic layer deposition method and method of forming capacitor of semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD84 citations97
US7646056B2Jan 12, 2010

Gate structures of a non-volatile memory device and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD39 citations92
US6946342B2Sep 20, 2005

Semiconductor device and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD22 citations92
US6897106B2May 24, 2005

Capacitor of semiconductor memory device that has composite Al2O3/HfO2 dielectric layer and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD29 citations92
US6599807B2Jul 29, 2003

Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics

SAMSUNG ELECTRONICS CO LTD33 citations92
US6207489B1Mar 27, 2001

Method for manufacturing capacitor of semiconductor memory device having tantalum oxide film

SAMSUNG ELECTRONICS CO LTD35 citations92
US10096688B2Oct 9, 2018

Integrated circuit device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD16 citations84
US9859393B2Jan 2, 2018

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD11 citations84
US7510931B2Mar 31, 2009

Method of fabricating a nonvolatile memory device

SAMSUNG ELECTRONICS CO LTD11 citations84
US6689696B2Feb 10, 2004

Method for manufacturing semiconductor device employing dielectric layer used to form conductive layer into three dimensional shape

SAMSUNG ELECTRONICS CO LTD16 citations84
US6448146B1Sep 10, 2002

Methods of manufacturing integrated circuit capacitors having hemispherical grain electrodes

SAMSUNG ELECTRONICS CO LTD17 citations84
US8790986B2Jul 29, 2014

Methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations82
US10403739B2Sep 3, 2019

Method for fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD13 citations80
US7094712B2Aug 22, 2006

High performance MIS capacitor with HfO2 dielectric

SAMSUNG ELECTRONICS CO LTD10 citations74
US6720275B2Apr 13, 2004

Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure

SAMSUNG ELECTRONICS CO LTD6 citations74
US6555394B2Apr 29, 2003

Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure

SAMSUNG ELECTRONICS CO LTD8 citations74
US10460927B2Oct 29, 2019

Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursor

SAMSUNG ELECTRONICS CO LTD2 citations73
US9559185B2Jan 31, 2017

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations73
US9390977B2Jul 12, 2016

Method for manufacturing a fin=shaped field effect transistor capable of reducing a threshold voltage variation

SAMSUNG ELECTRONICS CO LTD5 citations73
US10685957B2Jun 16, 2020

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US10026736B2Jul 17, 2018

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US7425493B2Sep 16, 2008

Methods of forming dielectric structures and capacitors

SAMSUNG ELECTRONICS CO LTD8 citations71
US7635633B2Dec 22, 2009

Non-volatile memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations63
US7402491B2Jul 22, 2008

Methods of manufacturing a semiconductor device including a dielectric layer including zirconium

SAMSUNG ELECTRONICS CO LTD4 citations63
US7279392B2Oct 9, 2007

Thin film structure, capacitor, and methods for forming the same

SAMSUNG ELECTRONICS CO LTD6 citations63
US9324781B2Apr 26, 2016

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US9059331B2Jun 16, 2015

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations62
US7800162B2Sep 21, 2010

Nonvolatile memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations60
US10529555B2Jan 7, 2020

Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursor

SAMSUNG ELECTRONICS CO LTD0 citations52
US8357593B2Jan 22, 2013

Methods of removing water from semiconductor substrates and methods of depositing atomic layers using the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7888727B2Feb 15, 2011

Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7566608B2Jul 28, 2009

Methods of forming thin layers including zirconium hafnium oxide and methods of forming gate structures, capacitors, and flash memory devices using the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7560349B2Jul 14, 2009

Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations52
US9685450B2Jun 20, 2017

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US8361551B2Jan 29, 2013

Methods forming high dielectric target layer

SAMSUNG ELECTRONICS CO LTD0 citations51
US7605067B2Oct 20, 2009

Method of manufacturing non-volatile memory device

SAMSUNG ELECTRONICS CO LTD0 citations50
US10797160B2Oct 6, 2020

Methods of fabricating semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations49
US9247403B2Jan 26, 2016

Method and apparatus for filtering a mobile high-definition link signal

SAMSUNG ELECTRONICS CO LTD0 citations48

LEE JONG-CHEOL

4 patents

PARK KI YEON

2 patents

TAK YONG SUK

1 patent