Inventor
PARK KI-YEON
KR45 patents
⚠️ This page may combine multiple inventors who share the name “PARK KI-YEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
38 patentsUS7151039B2Dec 19, 2006
Method of forming oxide layer using atomic layer deposition method and method of forming capacitor of semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD84 citations97
US7646056B2Jan 12, 2010
Gate structures of a non-volatile memory device and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD39 citations92
US6946342B2Sep 20, 2005
Semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD22 citations92
US6897106B2May 24, 2005
Capacitor of semiconductor memory device that has composite Al2O3/HfO2 dielectric layer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD29 citations92
US6599807B2Jul 29, 2003
Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics
SAMSUNG ELECTRONICS CO LTD33 citations92
US6207489B1Mar 27, 2001
Method for manufacturing capacitor of semiconductor memory device having tantalum oxide film
SAMSUNG ELECTRONICS CO LTD35 citations92
US10096688B2Oct 9, 2018
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD16 citations84
US9859393B2Jan 2, 2018
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7510931B2Mar 31, 2009
Method of fabricating a nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD11 citations84
US6689696B2Feb 10, 2004
Method for manufacturing semiconductor device employing dielectric layer used to form conductive layer into three dimensional shape
SAMSUNG ELECTRONICS CO LTD16 citations84
US6448146B1Sep 10, 2002
Methods of manufacturing integrated circuit capacitors having hemispherical grain electrodes
SAMSUNG ELECTRONICS CO LTD17 citations84
US8790986B2Jul 29, 2014
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations82
US10403739B2Sep 3, 2019
Method for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations80
US7094712B2Aug 22, 2006
High performance MIS capacitor with HfO2 dielectric
SAMSUNG ELECTRONICS CO LTD10 citations74
US6720275B2Apr 13, 2004
Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure
SAMSUNG ELECTRONICS CO LTD6 citations74
US6555394B2Apr 29, 2003
Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure
SAMSUNG ELECTRONICS CO LTD8 citations74
US10460927B2Oct 29, 2019
Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursor
SAMSUNG ELECTRONICS CO LTD2 citations73
US9559185B2Jan 31, 2017
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US9390977B2Jul 12, 2016
Method for manufacturing a fin=shaped field effect transistor capable of reducing a threshold voltage variation
SAMSUNG ELECTRONICS CO LTD5 citations73
US10685957B2Jun 16, 2020
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10026736B2Jul 17, 2018
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US7425493B2Sep 16, 2008
Methods of forming dielectric structures and capacitors
SAMSUNG ELECTRONICS CO LTD8 citations71
US7635633B2Dec 22, 2009
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US7402491B2Jul 22, 2008
Methods of manufacturing a semiconductor device including a dielectric layer including zirconium
SAMSUNG ELECTRONICS CO LTD4 citations63
US7279392B2Oct 9, 2007
Thin film structure, capacitor, and methods for forming the same
SAMSUNG ELECTRONICS CO LTD6 citations63
US9324781B2Apr 26, 2016
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US9059331B2Jun 16, 2015
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7800162B2Sep 21, 2010
Nonvolatile memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations60
US10529555B2Jan 7, 2020
Methods of fabricating a SiOCN layer using a first and second carbon precursor, the first carbon precursor being different from the second carbon precursor
SAMSUNG ELECTRONICS CO LTD0 citations52
US8357593B2Jan 22, 2013
Methods of removing water from semiconductor substrates and methods of depositing atomic layers using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7888727B2Feb 15, 2011
Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7566608B2Jul 28, 2009
Methods of forming thin layers including zirconium hafnium oxide and methods of forming gate structures, capacitors, and flash memory devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7560349B2Jul 14, 2009
Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US9685450B2Jun 20, 2017
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US8361551B2Jan 29, 2013
Methods forming high dielectric target layer
SAMSUNG ELECTRONICS CO LTD0 citations51
US7605067B2Oct 20, 2009
Method of manufacturing non-volatile memory device
SAMSUNG ELECTRONICS CO LTD0 citations50
US10797160B2Oct 6, 2020
Methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations49
US9247403B2Jan 26, 2016
Method and apparatus for filtering a mobile high-definition link signal
SAMSUNG ELECTRONICS CO LTD0 citations48
LEE JONG-CHEOL
4 patentsUS8159012B2Apr 17, 2012
Semiconductor device including insulating layer of cubic system or tetragonal system
LEE JONG-CHEOL7 citations82
US8258064B2Sep 4, 2012
Methods of forming a metal silicate layer and methods of fabricating a semiconductor device including the metal silicate layer
LEE JONG-CHEOL3 citations61
US8710564B2Apr 29, 2014
Semiconductor device including insulating layer of cubic system or tetragonal system
LEE JONG-CHEOL0 citations50
US8723250B2May 13, 2014
Integrated circuit devices including complex dielectric layers and related fabrication methods
LEE JONG-CHEOL0 citations47