Inventor
TAN CHEE VOON
MY11 patents
⚠️ This page may combine multiple inventors who share the name “TAN CHEE VOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
8 patentsUS11302613B2Apr 12, 2022
Double-sided cooled molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations60
US10886199B1Jan 5, 2021
Molded semiconductor package with double-sided cooling
INFINEON TECHNOLOGIES AG1 citations60
US9111772B1Aug 18, 2015
Electronic array and chip package
INFINEON TECHNOLOGIES AG3 citations60
US9263421B2Feb 16, 2016
Semiconductor device having multiple chips mounted to a carrier
INFINEON TECHNOLOGIES AG2 citations56
US11211356B2Dec 28, 2021
Power semiconductor package and method for fabricating a power semiconductor package
INFINEON TECHNOLOGIES AG0 citations53
US11699640B2Jul 11, 2023
Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production
INFINEON TECHNOLOGIES AG0 citations50
US11587800B2Feb 21, 2023
Semiconductor package with lead tip inspection feature
INFINEON TECHNOLOGIES AG0 citations47
US11515244B2Nov 29, 2022
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
INFINEON TECHNOLOGIES AG0 citations47