Inventor
LIANG FANG-YU
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIANG FANG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS10629539B2Apr 21, 2020
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US12564077B2Feb 24, 2026
Method of forming package structure including antennas
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148692B2Nov 19, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11973038B2Apr 30, 2024
Package structure with improved antenna patterns performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11682619B2Jun 20, 2023
Package component, semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309242B2Apr 19, 2022
Package component, semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11233019B2Jan 25, 2022
Manufacturing method of semicondcutor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11094642B2Aug 17, 2021
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11374303B2Jun 28, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11515274B2Nov 29, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10720399B2Jul 21, 2020
Semicondcutor package and manufacturing method of semicondcutor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
SILICONWARE PRECISION INDUSTRIES CO LTD
3 patentsUS10062651B2Aug 28, 2018
Packaging substrate and electronic package having the same
SILICONWARE PRECISION INDUSTRIES CO LTD48 citations93
US10199341B2Feb 5, 2019
Substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US10049975B2Aug 14, 2018
Substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71