Inventor
SHIKANO TAKETOSHI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “SHIKANO TAKETOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
17 patentsUS7855464B2Dec 21, 2010
Semiconductor device having a semiconductor chip and resin sealing portion
MITSUBISHI ELECTRIC CORP46 citations95
US7151311B2Dec 19, 2006
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer
MITSUBISHI ELECTRIC CORP19 citations83
US10104775B2Oct 16, 2018
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP9 citations82
US6791167B2Sep 14, 2004
Resin-molded device and manufacturing apparatus thereof
MITSUBISHI ELECTRIC CORP18 citations82
US9716072B2Jul 25, 2017
Power semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP5 citations73
US11107746B2Aug 31, 2021
Power semiconductor apparatus and manufacturing method therefor
MITSUBISHI ELECTRIC CORP2 citations72
US9627302B2Apr 18, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP5 citations70
US9437460B2Sep 6, 2016
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP5 citations69
US11387173B2Jul 12, 2022
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations62
US6753596B1Jun 22, 2004
Resin-sealed semiconductor device
MITSUBISHI ELECTRIC CORP3 citations62
US12538811B2Jan 27, 2026
Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin
MITSUBISHI ELECTRIC CORP0 citations57
US10541193B2Jan 21, 2020
Lead frame and method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations52
US12532793B2Jan 20, 2026
Semiconductor device and method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US12300569B2May 13, 2025
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US9691730B2Jun 27, 2017
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations51
US11735509B2Aug 22, 2023
Power semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP0 citations44
US9947613B2Apr 17, 2018
Power semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations38
SAKAMOTO KEN
3 patentsUS8518751B2Aug 27, 2013
Method for manufacturing semiconductor device including removing a resin burr
SAKAMOTO KEN2 citations60
US9466548B2Oct 11, 2016
Semiconductor device and method of manufacturing semiconductor device
SAKAMOTO KEN1 citations50
US8334176B2Dec 18, 2012
Method of manufacturing semiconductor device
SAKAMOTO KEN0 citations39