Inventor
RYAN VIVIAN W
US25 patents
⚠️ This page may combine multiple inventors who share the name “RYAN VIVIAN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
8 patentsUS8772158B2Jul 8, 2014
Multi-layer barrier layer stacks for interconnect structures
GLOBALFOUNDRIES INC5 citations84
US8623758B1Jan 7, 2014
Subtractive metal multi-layer barrier layer for interconnect structure
GLOBALFOUNDRIES INC8 citations84
US8877633B2Nov 4, 2014
Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system
GLOBALFOUNDRIES INC3 citations63
US8829675B2Sep 9, 2014
Repairing anomalous stiff pillar bumps
GLOBALFOUNDRIES INC3 citations60
US9209135B2Dec 8, 2015
Method for reducing wettability of interconnect material at corner interface and device incorporating same
GLOBALFOUNDRIES INC1 citations52
US9076792B2Jul 7, 2015
Multi-layer barrier layer stacks for interconnect structures
GLOBALFOUNDRIES INC0 citations52
US9059255B2Jun 16, 2015
Methods of forming non-continuous conductive layers for conductive structures on an integrated circuit product
GLOBALFOUNDRIES INC1 citations52
US8928146B2Jan 6, 2015
Bond pad configurations for controlling semiconductor chip package interactions
GLOBALFOUNDRIES INC0 citations52
RYAN VIVIAN W
7 patentsUS8441131B2May 14, 2013
Strain-compensating fill patterns for controlling semiconductor chip package interactions
RYAN VIVIAN W224 citations98
US8623754B1Jan 7, 2014
Repairing anomalous stiff pillar bumps
RYAN VIVIAN W8 citations81
US9269615B2Feb 23, 2016
Multi-layer barrier layer for interconnect structure
RYAN VIVIAN W2 citations62
US9021894B2May 5, 2015
Detecting anomalous weak BEOL sites in a metallization system
RYAN VIVIAN W3 citations60
US8728931B2May 20, 2014
Multi-layer barrier layer for interconnect structure
RYAN VIVIAN W0 citations52
US8680681B2Mar 25, 2014
Bond pad configurations for controlling semiconductor chip package interactions
RYAN VIVIAN W1 citations51
US8950269B2Feb 10, 2015
Detecting anomalous stiff pillar bumps formed above a metallization system
RYAN VIVIAN W0 citations49