Inventor
HATCHER JR MERRILL ALBERT
US18 patents
⚠️ This page may combine multiple inventors who share the name “HATCHER JR MERRILL ALBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
13 patentsUS10882740B2Jan 5, 2021
Wafer-level package with enhanced performance and manufacturing method thereof
QORVO US INC25 citations93
US10773952B2Sep 15, 2020
Wafer-level package with enhanced performance
QORVO US INC2 citations72
US11387157B2Jul 12, 2022
RF devices with enhanced performance and methods of forming the same
QORVO US INC2 citations71
US10103080B2Oct 16, 2018
Thermally enhanced semiconductor package with thermal additive and process for making the same
QORVO US INC4 citations71
US11063021B2Jul 13, 2021
Microelectronics package with vertically stacked dies
QORVO US INC0 citations62
US12368056B2Jul 22, 2025
RF devices with enhanced performance and methods of forming the same
QORVO US INC0 citations61
US12046483B2Jul 23, 2024
RF devices with enhanced performance and methods of forming the same
QORVO US INC0 citations61
US10486963B2Nov 26, 2019
Wafer-level package with enhanced performance
QORVO US INC1 citations61
US10804246B2Oct 13, 2020
Microelectronics package with vertically stacked dies
QORVO US INC0 citations52
US10804179B2Oct 13, 2020
Wafer-level package with enhanced performance
QORVO US INC0 citations51
US10755992B2Aug 25, 2020
Wafer-level packaging for enhanced performance
QORVO US INC0 citations51
US10490471B2Nov 26, 2019
Wafer-level packaging for enhanced performance
QORVO US INC0 citations51
US10262915B2Apr 16, 2019
Thermally enhanced semiconductor package with thermal additive and process for making the same
QORVO US INC0 citations50
RF MICRO DEVICES INC
3 patentsUS8492908B2Jul 23, 2013
Atomic layer deposition encapsulation for power amplifiers in RF circuits
RF MICRO DEVICES INC6 citations82
US9349938B2May 24, 2016
Atomic layer deposition encapsulation for acoustic wave devices
RF MICRO DEVICES INC0 citations51
US9082953B2Jul 14, 2015
Atomic layer deposition encapsulation for acoustic wave devices
RF MICRO DEVICES INC0 citations51