Inventor
KOO KYOWANG
KR21 patents
Patents
21 patentsUS10985109B2Apr 20, 2021
Shielded semiconductor packages with open terminals and methods of making via two-step process
STATS CHIPPAC PTE LTD10 citations85
US10784210B2Sep 22, 2020
Semiconductor device with partial EMI shielding removal using laser ablation
STATS CHIPPAC PTE LTD11 citations85
US11088082B2Aug 10, 2021
Semiconductor device with partial EMI shielding and method of making the same
STATS CHIPPAC PTE LTD7 citations84
US9997468B2Jun 12, 2018
Integrated circuit packaging system with shielding and method of manufacturing thereof
STATS CHIPPAC PTE LTD5 citations84
US10910322B2Feb 2, 2021
Shielded semiconductor package with open terminal and methods of making
STATS CHIPPAC PTE LTD4 citations83
US11935840B2Mar 19, 2024
Semiconductor device with partial EMI shielding removal using laser ablation
STATS CHIPPAC PTE LTD2 citations72
US11784133B2Oct 10, 2023
Shielded semiconductor package with open terminal and methods of making
STATS CHIPPAC PTE LTD2 citations72
US11444035B2Sep 13, 2022
Semiconductor device with partial EMI shielding removal using laser ablation
STATS CHIPPAC PTE LTD3 citations72
US11990421B2May 21, 2024
Semiconductor device with compartment shield formed from metal bars and manufacturing method thereof
STATS CHIPPAC PTE LTD2 citations65
US12341108B2Jun 24, 2025
Shielded semiconductor package with open terminal and methods of making
STATS CHIPPAC PTE LTD0 citations62
US12288753B2Apr 29, 2025
Semiconductor device with partial EMI shielding and method of making the same
STATS CHIPPAC PTE LTD0 citations62
US12211804B2Jan 28, 2025
Semiconductor device with partial EMI shielding removal using laser ablation
STATS CHIPPAC PTE LTD0 citations62
US11728281B2Aug 15, 2023
Shielded semiconductor packages with open terminals and methods of making via two-step process
STATS CHIPPAC PTE LTD0 citations62
US11145603B2Oct 12, 2021
Integrated circuit packaging system with shielding and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations62
US11024585B2Jun 1, 2021
Integrated circuit packaging system with shielding and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations62
US12564087B2Feb 24, 2026
Method for making semiconductor device with double side molding
STATS CHIPPAC PTE LTD0 citations55
US12308327B2May 20, 2025
Semiconductor device with compartment shield formed from metal bars and manufacturing method thereof
STATS CHIPPAC PTE LTD0 citations54
US12552192B2Feb 17, 2026
Selective stencil mask and a stencil printing method
STATS CHIPPAC PTE LTD0 citations53
US12431422B2Sep 30, 2025
Semiconductor device and method of forming RDL with graphene-coated core
STATS CHIPPAC PTE LTD0 citations53
US12575421B2Mar 10, 2026
Semiconductor device comprising different shielding layers to provide reduced electromagnetic interference and method for making the same
STATS CHIPPAC PTE LTD0 citations45
US12538433B2Jan 27, 2026
Stencil mask and stencil printing method
STATS CHIPPAC PTE LTD0 citations43