Inventor

GAO GUILIAN

US111 patents

⚠️ This page may combine multiple inventors who share the name “GAO GUILIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GAO GUILIAN

INVENSAS BONDING TECH INC

Interlayer connection of stacked microelectronic components

Molded direct bonded and interconnected stack

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics

Offset pads over TSV

Processed stacked dies

Low temperature bonded structures

Processing stacked substrates

Seal for microelectronic assembly

Large metal pads over TSV

Mitigating surface damage of probe pads in preparation for direct bonding of a substrate

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Techniques for processing devices

DBI to Si bonding for simplified handle wafer

Techniques for processing devices

Direct bonded stack structures for increased reliability and improved yield in microelectronics

Seal for microelectronic assembly

Processing stacked substrates

Seal for microelectronic assembly

INVENSAS CORP

Structures and methods for reliable packages

Structures and methods for reliable packages

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

Microelectronic assemblies with cavities, and methods of fabrication

System and method for providing 3D wafer assembly with known-good-dies

Bond via array for thermal conductivity

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Embedded graphite heat spreader for 3DIC

Anchoring structure of fine pitch bva

Hybrid 3D/2.5D interposer

Embedded graphite heat spreader for 3DIC

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Molded direct bonded and interconnected stack

Processed stacked dies

Molded direct bonded and interconnected stack

Molded direct bonded and interconnected stack

Metal pads over TSV

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Techniques for processing devices

TSV as pad

Offset pads over TSV

Low temperature bonded structures

Direct bonded stack structures for increased reliability and improved yield in microelectronics

DBI to SI bonding for simplified handle wafer

FORD MOTOR CO

Laser soldering process employing an energy absorptive coating

Carbon dioxide-based fluxing media for non-VOC, no-clean soldering

Solvent-less vapor deposition apparatus and process for application of soldering fluxes

Water-based no-clean flux formulation

TESSERA INC

Microelectronic packages and methods therefor

Microelectronic assemblies having compliancy and methods therefor

FORD GLOBAL TECH LLC

Method for selective control of corrosion using kinetic spraying