P

Inventor

CHEN KEN

CN53 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

13 patents
US6770958B2Aug 3, 2004

Under bump metallization structure

TAIWAN SEMICONDUCTOR MFG80 citations98
US6656827B1Dec 2, 2003

Electrical performance enhanced wafer level chip scale package with ground

TAIWAN SEMICONDUCTOR MFG142 citations98
US6939789B2Sep 6, 2005

Method of wafer level chip scale packaging

TAIWAN SEMICONDUCTOR MFG84 citations97
US6596619B1Jul 22, 2003

Method for fabricating an under bump metallization structure

TAIWAN SEMICONDUCTOR MFG48 citations96
US6552267B2Apr 22, 2003

Microelectronic assembly with stiffening member

TAIWAN SEMICONDUCTOR MFG27 citations93
US6528417B1Mar 4, 2003

Metal patterned structure for SiN surface adhesion enhancement

TAIWAN SEMICONDUCTOR MFG24 citations93
US6782897B2Aug 31, 2004

Method of protecting a passivation layer during solder bump formation

TAIWAN SEMICONDUCTOR MFG52 citations92
US7015066B2Mar 21, 2006

Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly

TAIWAN SEMICONDUCTOR MFG11 citations84
US6774026B1Aug 10, 2004

Structure and method for low-stress concentration solder bumps

TAIWAN SEMICONDUCTOR MFG14 citations84
US6960518B1Nov 1, 2005

Buildup substrate pad pre-solder bump manufacturing

TAIWAN SEMICONDUCTOR MFG12 citations83
US6638837B1Oct 28, 2003

Method for protecting the front side of semiconductor wafers

TAIWAN SEMICONDUCTOR MFG12 citations73
US6884662B1Apr 26, 2005

Enhanced adhesion strength between mold resin and polyimide

TAIWAN SEMICONDUCTOR MFG2 citations62
US7390697B2Jun 24, 2008

Enhanced adhesion strength between mold resin and polyimide

TAIWAN SEMICONDUCTOR MFG0 citations51

NUTANIX INC

4 patents

MICROSOFT TECHNOLOGY LICENSING LLC

4 patents

CHEN KEN

3 patents

SAMSUNG ELECTRONICS CO LTD

3 patents

UNIV PEKING FOUNDER GROUP CO

3 patents

CRYOCATH TECHNOLOGIES INC

2 patents

AVIVA BIOSCIENCES

2 patents

SPLUNK INC

2 patents

MEDTRONIC CRYOCATH LP

1 patent

LITE ON TECHNOLOGY CORP

1 patent

AITECH INTL CORP

1 patent

BEIJING XIAOMI MOBILE SOFTWARE CO LTD

1 patent

ICE COMPONENTS INC

1 patent

BOLTBOLT LLC

1 patent

SILITEK CORP

1 patent

DEVREV INC

1 patent

IBM

1 patent

UNIV TSINGHUA

1 patent

INVENTEC CORP

1 patent

HON DAVID TAK-WEI

1 patent

THIRD AFFILIATED HOSPITAL THIRD MILITARY MEDICAL UNIV

1 patent

NUNTANIX INC

1 patent

Showing the top 50 of 53 patents by PatentIndex Score.