Inventor
VAN STRATEN FREEK EGBERT
NL12 patents
⚠️ This page may combine multiple inventors who share the name “VAN STRATEN FREEK EGBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
6 patentsUS12506084B2Dec 23, 2025
Methods of fabricating substrates with thermal vias and sinter-bonded thermal dissipation structures
NXP USA INC0 citations62
US11929310B2Mar 12, 2024
Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods
NXP USA INC0 citations62
US11842957B2Dec 12, 2023
Amplifier modules and systems with ground terminals adjacent to power amplifier die
NXP USA INC1 citations62
US11621228B2Apr 4, 2023
Substrate with thermal vias and sinter-bonded thermal dissipation structure
NXP USA INC1 citations62
US12014971B2Jun 18, 2024
Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof
NXP USA INC0 citations60
US12482719B2Nov 25, 2025
Low-stress thermal interface
NXP USA INC0 citations49