Inventor

PARK KYOUNGHEE

KR27 patents

⚠️ This page may combine multiple inventors who share the name “PARK KYOUNGHEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK KYOUNGHEE

STATS CHIPPAC PTE LTD

Laser-based redistribution and multi-stacked packages

Laser-based redistribution and multi-stacked packages

Semiconductor device with partial EMI shielding and method of making the same

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of manufacturing thereof

EMI shielding for flip chip package with exposed die backside

Selective EMI shielding using preformed mask

Mask design for improved attach position

Selective EMI shielding using preformed mask

Selective EMI shielding using preformed mask with fang design

Mask design for improved attach position

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages

Semiconductor device with partial EMI shielding and method of making the same

Selective EMI shielding using preformed mask with fang design

Antenna-in-package devices and methods of making

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of manufacture thereof

Integrated circuit packaging system with shielding and method of manufacture thereof

Emi shielding for flip chip package with exposed die backside

Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes

Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof

KANG MINKYUNG

Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof

ROH YOUNGDAL

Method of manufacture of support system with fine pitch

JEON DONG JU

Integrated circuit packaging system with embedded component and method of manufacture thereof

JUNG JINHEE

Integrated circuit packaging system with coreless substrate and method of manufacture thereof

JCET STATS CHIPPAC KOREA LTD

Method for making electronic package