Inventor

JEON OSEOB

KR35 patents

⚠️ This page may combine multiple inventors who share the name “JEON OSEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEON OSEOB

SEMICONDUCTOR COMPONENTS IND LLC

Stray inductance reduction in packaged semiconductor devices and modules

Semiconductor device package assemblies with direct leadframe attachment

Power module package and method of manufacturing the same

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices

Semiconductor package having junction cooling pipes embedded in substrates

Integration of semiconductor device assemblies with thermal dissipation mechanisms

Semiconductor device package assemblies with direct leadframe attachment

Dual side direct cooling semiconductor package

Semiconductor die package including a one-body clip

Power module package

High power module package structures

Integration of semiconductor device assemblies with thermal dissipation mechanisms

Immersion direct cooling modules

Jet impingement heatsink for high power semiconductor devices

Integrated circuit direct cooling systems having substrates in contact with a cooling medium

Semiconductor package having a spacer with a junction cooling pipe

Transfer molded power modules and methods of manufacture

Thermal mismatch reduction in semiconductor device modules

Semiconductor device modules

Current sharing mismatch reduction in power semiconductor device modules

Switching oscillation reduction for power semiconductor device modules

Semiconductor device package assemblies and methods of manufacture

FAIRCHILD SEMICONDUCTOR

Semiconductor package and related methods

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Apparatus related to an improved package including a semiconductor die

Semiconductor package and related methods

Package including a semiconductor die and a capacitive component

Semiconductor die package and method for making the same

Wafer level MOSFET metallization

JEON OSEOB

Semiconductor die package and method for making the same

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Semiconductor die package and method for making the same

KINZER DANIEL M

Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same

LEE KEUNHYUK

Power module package having excellent heat sink emission capability and method for manufacturing the same