Inventor

POCH LEONARD J

US2 patents

⚠️ This page may combine multiple inventors who share the name “POCH LEONARD J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

1 patent

US4553192ANov 12, 1985

High density planar interconnected integrated circuit package

IBM248 citations95

UNIVERSAL INSTRUMENTS CORP

1 patent

US5694482ADec 2, 1997

System and method for locating solder bumps on semiconductor chips or chip carriers

UNIVERSAL INSTRUMENTS CORP79 citations88