Inventor
SAKAI KUNITO
JP10 patents
Patents
10 patentsUS4769344ASep 6, 1988
Method of resin encapsulating a semiconductor device
MITSUBISHI ELECTRIC CORP176 citations98
US4697203ASep 29, 1987
Semiconductor device and manufacturing method therefor
MITSUBISHI ELECTRIC CORP67 citations95
US4717948AJan 5, 1988
Semiconductor device
MITSUBISHI ELECTRIC CORP62 citations94
US5082615AJan 21, 1992
Method for packaging semiconductor devices in a resin
MITSUBISHI ELECTRIC CORP36 citations92
US4812420AMar 14, 1989
Method of producing a semiconductor device having a light transparent window
MITSUBISHI ELECTRIC CORP45 citations92
US5798070AAug 25, 1998
Encapsulation method
MITSUBISHI ELECTRIC CORP18 citations90
US5395226AMar 7, 1995
Molding machine and method
MITSUBISHI ELECTRIC CORP33 citations90
US5597523AJan 28, 1997
Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure
MITSUBISHI ELECTRIC CORP18 citations82
US4963307AOct 16, 1990
Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet
MITSUBISHI ELECTRIC CORP13 citations69
US4826931AMay 2, 1989
Tablet for resin-molding semiconductor devices
MITSUBISHI ELECTRIC CORP4 citations58