Inventor
WANG JIUN-FANG
TW20 patents
⚠️ This page may combine multiple inventors who share the name “WANG JIUN-FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RODEL INC
8 patentsUS5738800AApr 14, 1998
Composition and method for polishing a composite of silica and silicon nitride
RODEL INC117 citations98
US5389352AFeb 14, 1995
Oxide particles and method for producing them
RODEL INC117 citations98
US5693239ADec 2, 1997
Polishing slurries comprising two abrasive components and methods for their use
RODEL INC133 citations97
US5756398AMay 26, 1998
Composition and method for polishing a composite comprising titanium
RODEL INC52 citations96
US6218305B1Apr 17, 2001
Composition and method for polishing a composite of silica and silicon nitride
RODEL INC72 citations95
US6132637AOct 17, 2000
Composition and method for polishing a composite of silica and silicon nitride
RODEL INC44 citations95
US6042741AMar 28, 2000
Composition for polishing a composite of silica and silicon nitride
RODEL INC74 citations95
US5769689AJun 23, 1998
Compositions and methods for polishing silica, silicates, and silicon nitride
RODEL INC97 citations94
PROMOS TECHNOLOGIES INC
8 patentsUS6632742B2Oct 14, 2003
Method for avoiding defects produced in the CMP process
PROMOS TECHNOLOGIES INC57 citations95
US6749484B2Jun 15, 2004
Chemical mechanical polishing (CMP) apparatus with temperature control
PROMOS TECHNOLOGIES INC19 citations92
US6432728B1Aug 13, 2002
Method for integration optimization by chemical mechanical planarization end-pointing technique
PROMOS TECHNOLOGIES INC43 citations90
US6227949B1May 8, 2001
Two-slurry CMP polishing with different particle size abrasives
PROMOS TECHNOLOGIES INC30 citations90
US6130163AOct 10, 2000
Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water
PROMOS TECHNOLOGIES INC17 citations83
US6053802AApr 25, 2000
Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse
PROMOS TECHNOLOGIES INC8 citations71
US6306022B1Oct 23, 2001
Chemical-mechanical polishing device
PROMOS TECHNOLOGIES INC8 citations65
US6478659B2Nov 12, 2002
Chemical mechanical polishing method for slurry free fixed abrasive pads
PROMOS TECHNOLOGIES INC4 citations59
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC
3 patentsUS11339308B2May 24, 2022
Chemical mechanical polishing method
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10573524B2Feb 25, 2020
Method of chemical mechanical polishing a semiconductor substrate
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations41
US10557060B2Feb 11, 2020
Method of chemical mechanical polishing a substrate
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations40