Inventor
SPALDING PETER HOWARD
US16 patents
Patents
16 patentsUS6348726B1Feb 19, 2002
Multi row leadless leadframe package
NAT SEMICONDUCTOR CORP264 citations98
US6372539B1Apr 16, 2002
Leadless packaging process using a conductive substrate
NAT SEMICONDUCTOR CORP71 citations96
US6452255B1Sep 17, 2002
Low inductance leadless package
NAT SEMICONDUCTOR CORP103 citations95
US6399415B1Jun 4, 2002
Electrical isolation in panels of leadless IC packages
NAT SEMICONDUCTOR CORP145 citations95
US6674156B1Jan 6, 2004
Multiple row fine pitch leadless leadframe package with use of half-etch process
NAT SEMICONDUCTOR CORP39 citations92
US6617197B1Sep 9, 2003
Multi row leadless leadframe package
NAT SEMICONDUCTOR CORP19 citations92
US6483180B1Nov 19, 2002
Lead frame design for burr-free singulation of molded array packages
NAT SEMICONDUCTOR CORP48 citations92
US6448107B1Sep 10, 2002
Pin indicator for leadless leadframe packages
NAT SEMICONDUCTOR CORP39 citations91
US5789806AAug 4, 1998
Leadframe including bendable support arms for downsetting a die attach pad
NAT SEMICONDUCTOR CORP34 citations87
US6551048B1Apr 22, 2003
Off-load system for semiconductor devices
NAT SEMICONDUCTOR CORP11 citations73
US6677667B1Jan 13, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP11 citations72
US6576989B1Jun 10, 2003
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP10 citations72
US6963124B1Nov 8, 2005
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP0 citations51
US6933174B1Aug 23, 2005
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6818970B1Nov 16, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6808961B1Oct 26, 2004
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP1 citations51