Inventor
DURCAN MARK
US18 patents
⚠️ This page may combine multiple inventors who share the name “DURCAN MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
17 patentsUS6734482B1May 11, 2004
Trench buried bit line memory devices
MICRON TECHNOLOGY INC112 citations99
US6331488B1Dec 18, 2001
Planarization process for semiconductor substrates
MICRON TECHNOLOGY INC123 citations99
US6310366B1Oct 30, 2001
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC425 citations99
US6806137B2Oct 19, 2004
Trench buried bit line memory devices and methods thereof
MICRON TECHNOLOGY INC69 citations96
US7365384B2Apr 29, 2008
Trench buried bit line memory devices and methods thereof
MICRON TECHNOLOGY INC25 citations92
US6858460B2Feb 22, 2005
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC12 citations92
US6787819B2Sep 7, 2004
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC18 citations92
US6686220B2Feb 3, 2004
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC17 citations92
US6483129B2Nov 19, 2002
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC21 citations92
US6445014B1Sep 3, 2002
Retrograde well structure for a CMOS imager
MICRON TECHNOLOGY INC32 citations92
US6340624B1Jan 22, 2002
Method of forming a circuitry isolation region within a semiconductive wafer
MICRON TECHNOLOGY INC18 citations92
US6100162AAug 8, 2000
Method of forming a circuitry isolation region within a semiconductive wafer
MICRON TECHNOLOGY INC18 citations92
US6743724B2Jun 1, 2004
Planarization process for semiconductor substrates
MICRON TECHNOLOGY INC11 citations74
US7170124B2Jan 30, 2007
Trench buried bit line memory devices and methods thereof
MICRON TECHNOLOGY INC2 citations63
US6599800B2Jul 29, 2003
Methods of forming capacitors, and methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions
MICRON TECHNOLOGY INC1 citations63
US6417102B1Jul 9, 2002
Semiconductor processing method using high pressure liquid media treatment
MICRON TECHNOLOGY INC0 citations52
US6333264B1Dec 25, 2001
Semiconductor processing method using high pressure liquid media treatment
MICRON TECHNOLOGY INC0 citations52