Inventor
CHUANG JONNIE
TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHUANG JONNIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HARVATEK CORP
39 patentsUS6784458B1Aug 31, 2004
Random partitionable dot matrix LED display
HARVATEK CORP20 citations93
US7563641B2Jul 21, 2009
Laminated light-emitting diode display device and manufacturing method thereof
HARVATEK CORP21 citations92
US7140753B2Nov 28, 2006
Water-cooling heat dissipation device adopted for modulized LEDs
HARVATEK CORP41 citations91
US7049639B2May 23, 2006
LED packaging structure
HARVATEK CORP33 citations91
US6841934B2Jan 11, 2005
White light source from light emitting diode
HARVATEK CORP22 citations91
USD511328SNov 8, 2005
Light-emitting diode
HARVATEK CORP26 citations89
US7828464B2Nov 9, 2010
LED lamp structure and system with high-efficiency heat-dissipating function
HARVATEK CORP11 citations84
US7671373B2Mar 2, 2010
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
HARVATEK CORP9 citations84
US7671374B2Mar 2, 2010
LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
HARVATEK CORP9 citations84
US7237938B2Jul 3, 2007
Backlight module
HARVATEK CORP14 citations83
US7834365B2Nov 16, 2010
LED chip package structure with high-efficiency light-emitting effect and method of packing the same
HARVATEK CORP7 citations73
USD509809SSep 20, 2005
Metal base design for surface mount device LED
HARVATEK CORP10 citations73
US6919584B2Jul 19, 2005
White light source
HARVATEK CORP9 citations73
USD506732SJun 28, 2005
Light-emitting diode
HARVATEK CORP8 citations73
US7211882B2May 1, 2007
LED package structure and method for making the same
HARVATEK CORP8 citations72
USD506187SJun 14, 2005
Metal base design for surface mount device LED (light emitting diode)
HARVATEK CORP9 citations72
US7255463B2Aug 14, 2007
Lighting module
HARVATEK CORP8 citations68
US7737635B2Jun 15, 2010
High efficiency white light emitting diode and method for manufacturing the same
HARVATEK CORP2 citations63
US7142181B2Nov 28, 2006
Circuit board for large screen LED matrix array display
HARVATEK CORP4 citations63
USD507544SJul 19, 2005
Light emitting diode package
HARVATEK CORP4 citations63
US6885037B1Apr 26, 2005
IC package with stacked sheet metal substrate
HARVATEK CORP2 citations63
US7803641B2Sep 28, 2010
Mold structure for packaging LED chips and method thereof
HARVATEK CORP5 citations62
US7485480B2Feb 3, 2009
Method of manufacturing high power light-emitting device package and structure thereof
HARVATEK CORP3 citations62
US7804162B2Sep 28, 2010
Multi-wavelength white light-emitting structure
HARVATEK CORP4 citations61
US7655997B2Feb 2, 2010
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same
HARVATEK CORP2 citations61
US7276782B2Oct 2, 2007
Package structure for semiconductor
HARVATEK CORP4 citations58
US8003413B2Aug 23, 2011
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
HARVATEK CORP0 citations52
US7842964B2Nov 30, 2010
Front and rear covering type LED package structure and method for packaging the same
HARVATEK CORP0 citations52
US7824938B2Nov 2, 2010
Method for manufacturing an LED chip package structure
HARVATEK CORP0 citations52
US7741648B2Jun 22, 2010
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
HARVATEK CORP0 citations52
US7662661B2Feb 16, 2010
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof
HARVATEK CORP1 citations52
US7303984B2Dec 4, 2007
Semiconductor substrate structure and processing method thereof
HARVATEK CORP0 citations52
USD507246SJul 12, 2005
Light emitting diode package
HARVATEK CORP0 citations52
US7951621B2May 31, 2011
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
HARVATEK CORP1 citations51
US7923745B2Apr 12, 2011
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
HARVATEK CORP1 citations51
USD509195SSep 6, 2005
Light emitting diode package
HARVATEK CORP1 citations50
US7701124B2Apr 20, 2010
White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend
HARVATEK CORP0 citations47
US7749781B2Jul 6, 2010
Method for manufacturing a light-emitting diode having high heat-dissipating efficiency
HARVATEK CORP1 citations46
US7515061B2Apr 7, 2009
LED package structure for increasing light-emitting efficiency and method of packaging the same
HARVATEK CORP0 citations42