Inventor
MAGERLEIN JOHN H
US14 patents
⚠️ This page may combine multiple inventors who share the name “MAGERLEIN JOHN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS7990711B1Aug 2, 2011
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
IBM142 citations98
US7928562B2Apr 19, 2011
Segmentation of a die stack for 3D packaging thermal management
IBM58 citations97
US7189595B2Mar 13, 2007
Method of manufacture of silicon based package and devices manufactured thereby
IBM21 citations92
US7202764B2Apr 10, 2007
Noble metal contacts for micro-electromechanical switches
IBM39 citations91
US8581392B2Nov 12, 2013
Silicon based microchannel cooling and electrical package
IBM8 citations84
US7855442B2Dec 21, 2010
Silicon based package
IBM10 citations84
US7638406B2Dec 29, 2009
Method of fabricating a high Q factor integrated circuit inductor
IBM13 citations84
US7068138B2Jun 27, 2006
High Q factor integrated circuit inductor
IBM12 citations84
US7829427B2Nov 9, 2010
Method of fabricating a high Q factor integrated circuit inductor
IBM4 citations63
US7128472B2Oct 31, 2006
Method and apparatus for providing optoelectronic communication with an electronic device
IBM3 citations62
US7581314B2Sep 1, 2009
Method of forming noble metal contacts
IBM5 citations61