Inventor
JIN BEOM-JUN
KR22 patents
⚠️ This page may combine multiple inventors who share the name “JIN BEOM-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS6897109B2May 24, 2005
Methods of manufacturing integrated circuit devices having contact holes using multiple insulating layers
SAMSUNG ELECTRONICS CO LTD92 citations98
US8659946B2Feb 25, 2014
Non-volatile memory devices including vertical NAND strings and methods of forming the same
SAMSUNG ELECTRONICS CO LTD13 citations92
US7009257B2Mar 7, 2006
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad and integrated circuit devices formed thereby
SAMSUNG ELECTRONICS CO LTD5 citations74
US6818551B2Nov 16, 2004
Methods of forming contact holes using multiple insulating layers
SAMSUNG ELECTRONICS CO LTD8 citations74
US6689654B2Feb 10, 2004
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad
SAMSUNG ELECTRONICS CO LTD6 citations74
US6576963B2Jun 10, 2003
Semiconductor device having transistor
SAMSUNG ELECTRONICS CO LTD9 citations74
US7153750B2Dec 26, 2006
Methods of forming capacitors of semiconductor devices including silicon-germanium and metallic electrodes
SAMSUNG ELECTRONICS CO LTD7 citations73
US7271408B2Sep 18, 2007
Semiconductor device test patterns and related methods for precisely measuring leakage currents in semiconductor cell transistors
SAMSUNG ELECTRONICS CO LTD5 citations63
US6984568B2Jan 10, 2006
Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US6664585B2Dec 16, 2003
Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7785964B2Aug 31, 2010
Non-volatile semiconductor memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations59
US7399670B2Jul 15, 2008
Methods of forming different gate structures in NMOS and PMOS regions and gate structures so formed
SAMSUNG ELECTRONICS CO LTD0 citations52
US7060575B2Jun 13, 2006
Semiconductor device having transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9627360B2Apr 18, 2017
Circuit board having bypass pad
SAMSUNG ELECTRONICS CO LTD0 citations50
US9449716B2Sep 20, 2016
Circuit board having bypass pad
SAMSUNG ELECTRONICS CO LTD0 citations50
US9171644B2Oct 27, 2015
Circuit board having bypass pad
SAMSUNG ELECTRONICS CO LTD0 citations50
US9069036B2Jun 30, 2015
Circuit board having bypass pad
SAMSUNG ELECTRONICS CO LTD0 citations50
JIN BEOM-JUN
3 patentsUS8971118B2Mar 3, 2015
Methods of forming non-volatile memory devices including vertical NAND strings
JIN BEOM-JUN35 citations96
US8325527B2Dec 4, 2012
Non-volatile memory devices including vertical NAND strings and methods of forming the same
JIN BEOM-JUN30 citations91
US9373633B2Jun 21, 2016
Methods of forming non-volatile memory devices including vertical NAND strings
JIN BEOM-JUN4 citations83