P

Inventor

LEE CHIA-HSIEN

TW13 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIA-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WISTRON CORP

5 patents
US7171503B2Jan 30, 2007

Mini PCI module having integrated antenna pin set for electrically connecting to an antenna set in a mini PCI slot

WISTRON CORP14 citations81
US8556154B2Oct 15, 2013

Clamping tool and equipment for rework process

WISTRON CORP4 citations60
US7312983B2Dec 25, 2007

Expansion socket for digital video devices

WISTRON CORP4 citations56
US8740046B2Jun 3, 2014

Soldering system of soldering a dip component on a circuit board

WISTRON CORP0 citations49
US8656583B2Feb 25, 2014

Method for assembling components on a circuit board

WISTRON CORP0 citations46

LIN KUO-KUN

2 patents
US8081436B2Dec 20, 2011

Auxiliary mechanism

LIN KUO-KUN3 citations58
US8416560B2Apr 9, 2013

Auxiliary mechanism

LIN KUO-KUN0 citations47

HSIEH HAO-CHUN

2 patents
US8690041B2Apr 8, 2014

Method and soldering system of soldering a DIP component on a circuit board

HSIEH HAO-CHUN2 citations57
US8462520B2Jun 11, 2013

Metal shielding can and assembly of the metal shielding can and a circuit board

HSIEH HAO-CHUN1 citations42

YAMAHA MOTOR CO LTD

1 patent
US7367701B2May 6, 2008

Headlight assembly structure for a motorcycle

YAMAHA MOTOR CO LTD19 citations82

YAMAHA MOTOR R & D TAIWAN CO L

1 patent
US7114836B2Oct 3, 2006

Motorcycle and tail light structure thereof

YAMAHA MOTOR R & D TAIWAN CO L9 citations60

Yang jun-min

1 patent
US8387233B2Mar 5, 2013

System for assembling components on a circuit board

Yang jun-min0 citations39

LEE CHIA-HSIEN

1 patent
US8070050B2Dec 6, 2011

Heat conducting apparatus and solder melting method therefor

LEE CHIA-HSIEN0 citations32