Inventor
IKEDA TOMOYUKI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “IKEDA TOMOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
13 patentsUS7371974B2May 13, 2008
Multilayer printed wiring board
IBIDEN CO LTD43 citations96
US7786390B2Aug 31, 2010
Printed wiring board and a method of production thereof
IBIDEN CO LTD29 citations92
US7378602B2May 27, 2008
Multilayer core board and manufacturing method thereof
IBIDEN CO LTD36 citations92
US9807885B2Oct 31, 2017
Wiring board with built-in electronic component and method for manufacturing the same
IBIDEN CO LTD8 citations84
US7905014B2Mar 15, 2011
Manufacturing method of multilayer core board
IBIDEN CO LTD6 citations73
US8030579B2Oct 4, 2011
Multilayer printed wiring board
IBIDEN CO LTD3 citations62
US12189193B2Jan 7, 2025
Semiconductor package
IBIDEN CO LTD0 citations52
US12169312B2Dec 17, 2024
Semiconductor package
IBIDEN CO LTD0 citations52
US12193156B2Jan 7, 2025
Wiring substrate and method for manufacturing wiring substrate
IBIDEN CO LTD0 citations51
US11715698B2Aug 1, 2023
Wiring substrate
IBIDEN CO LTD0 citations51
US12213248B2Jan 28, 2025
Printed wiring board
IBIDEN CO LTD0 citations45
US11277910B2Mar 15, 2022
Wiring substrate
IBIDEN CO LTD0 citations43
US11089674B2Aug 10, 2021
Wiring substrate and method for manufacturing wiring substrate
IBIDEN CO LTD0 citations43
IKEDA TOMOYUKI
6 patentsUS8242379B2Aug 14, 2012
Multilayered printed wiring board with a multilayered core substrate
IKEDA TOMOYUKI18 citations90
US8101865B2Jan 24, 2012
Printed wiring board and a method of production thereof
IKEDA TOMOYUKI8 citations83
US9029711B2May 12, 2015
Method for manufacturing a printed wiring board having a through-hole conductor
IKEDA TOMOYUKI2 citations62
US8324506B2Dec 4, 2012
Printed wiring board and a method of production thereof
IKEDA TOMOYUKI1 citations62
US8890000B2Nov 18, 2014
Printed wiring board having through-hole and a method of production thereof
IKEDA TOMOYUKI0 citations51
US8966750B2Mar 3, 2015
Method of manufacturing a multilayered printed wiring board
IKEDA TOMOYUKI1 citations49
NOF CORP
2 patentsUS6254973B1Jul 3, 2001
Fluorine-containing polyfunctional (meth) acrylate, fluorine containing monomer composition, low refractivity material, and reflection reducing film
NOF CORP20 citations92
US6087010AJul 11, 2000
Fluorine-containing polyfunctional (meth) acrylate composition low refractivity material and reflection reducing film
NOF CORP25 citations92