Inventor

TSAI CHENG KUN

TW23 patents

⚠️ This page may combine multiple inventors who share the name “TSAI CHENG KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI CHENG KUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of post optical proximity correction (OPC) printing verification by machine learning

Optical proximity correction methodology using pattern classification for target placement

Method for integrated circuit manufacturing

Methodology for pattern density optimization

Optical proximity correction methodology using underlying layer information

Methodology for pattern density optimization

Methodology for pattern correction

Method of post optical proximity correction (OPC) printing verification by machine learning

Providing electron beam proximity effect correction by simulating write operations of polygonal shapes

Methodology for pattern density optimization

Method for integrated circuit manufacturing

Optical proximity correction methodology using pattern classification for target placement

TAIWAN SEMICONDUCTOR MFG

Methodology of optical proximity correction optimization

Dissection splitting with optical proximity correction and mask rule check enforcement

Method for integrated circuit manufacturing

Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit design

WANG HUNG-CHUN

Pattern correction with location effect

Methodology of optical proximity correction optimization

Providing electron beam proximity effect correction by simulating write operations of polygonal shapes

CHIH MING-HUI

Method and apparatus of patterning semiconductor device

Method and apparatus of patterning semiconductor device

CHIANG CHIA-PING

Dissection splitting with optical proximity correction to reduce corner rounding

HSIEH KEN-HSIEN

Double patterning methodology