Inventor
HSU CHIH CHUNG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIH CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CORETECH SYS CO LTD
9 patentsUS9409335B1Aug 9, 2016
Computer-implemented simulation method and non-transitory computer medium for use in molding process
CORETECH SYS CO LTD8 citations81
US11602908B1Mar 14, 2023
Method of mesh generation for resin transfer molding process
CORETECH SYS CO LTD4 citations69
US11355361B1Jun 7, 2022
Method of measuring underfill profile of underfill cavity having solder bumps
CORETECH SYS CO LTD2 citations66
US10960592B2Mar 30, 2021
Computer-implemented simulation method for injection-molding process
CORETECH SYS CO LTD1 citations57
US9081923B1Jul 14, 2015
Computer-implemented composite simulation method and non-transitory computer medium for use in molding process
CORETECH SYS CO LTD2 citations57
US11521903B1Dec 6, 2022
Method of measuring voids in underfill package
CORETECH SYS CO LTD1 citations56
US12235614B2Feb 25, 2025
Molding system for fabricating fiber reinforcement polymer composite article and molding method thereof
CORETECH SYS CO LTD0 citations47
US11376776B2Jul 5, 2022
Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same
CORETECH SYS CO LTD0 citations44
US10864667B2Dec 15, 2020
Molding system for preparing an in-mold decorated article
CORETECH SYS CO LTD0 citations38