Inventor

REBHAN BERNHARD

AT7 patents

⚠️ This page may combine multiple inventors who share the name “REBHAN BERNHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EV GROUP E THALLNER GMBH

3 patents

US9640510B2May 2, 2017

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

EV GROUP E THALLNER GMBH9 citations80

US9947638B2Apr 17, 2018

Device and method for permanent bonding

EV GROUP E THALLNER GMBH2 citations71

US9358765B2Jun 7, 2016

Method for coating and bonding substrates

EV GROUP E THALLNER GMBH0 citations50

MARTINSCHITZ KLAUS

2 patents

US10163681B2Dec 25, 2018

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

MARTINSCHITZ KLAUS3 citations66

US9067363B2Jun 30, 2015

Method and device for permanent bonding of wafers, as well as cutting tool

MARTINSCHITZ KLAUS6 citations66

REBHAN BERNHARD

2 patents

US9500541B2Nov 22, 2016

Method and device for determining the pressure distribution for bonding

REBHAN BERNHARD0 citations45

US9443820B2Sep 13, 2016

Device and method for bonding substrates

REBHAN BERNHARD1 citations43