Inventor
UANG RUOH-HUEY
TW16 patents
⚠️ This page may combine multiple inventors who share the name “UANG RUOH-HUEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
10 patentsUS6989325B2Jan 24, 2006
Self-assembled nanometer conductive bumps and method for fabricating
IND TECH RES INST87 citations97
US6268114B1Jul 31, 2001
Method for forming fine-pitched solder bumps
IND TECH RES INST97 citations97
US6539624B1Apr 1, 2003
Method for forming wafer level package
IND TECH RES INST31 citations92
US6440836B1Aug 27, 2002
Method for forming solder bumps on flip chips and devices formed
IND TECH RES INST33 citations91
US6179200B1Jan 30, 2001
Method for forming solder bumps of improved height and devices formed
IND TECH RES INST35 citations91
US7163885B2Jan 16, 2007
Method of migrating and fixing particles in a solution to bumps on a chip
IND TECH RES INST11 citations83
US7605474B2Oct 20, 2009
Structure of polymer-matrix conductive film and method for fabricating the same
IND TECH RES INST4 citations71
US7526861B2May 5, 2009
Method for fabricating structure of polymer-matrix conductive film
IND TECH RES INST3 citations60
US7598609B2Oct 6, 2009
Structure of polymer-matrix conductive film and method for fabricating the same
IND TECH RES INST3 citations57
US8802557B2Aug 12, 2014
Micro bump and method for forming the same
IND TECH RES INST1 citations51
LEE CHANG YUNG CHEMICAL IND CORP
3 patentsUS9617373B2Apr 11, 2017
Curable resin composition, article, and method for fabricating the same
LEE CHANG YUNG CHEMICAL IND CORP0 citations45
US9616697B2Apr 11, 2017
Blanket for transferring a paste image from an engraved plate to a substrate
LEE CHANG YUNG CHEMICAL IND CORP0 citations43
US9573405B2Feb 21, 2017
Method and blanket for transferring a paste image from engraved plate to substrate
LEE CHANG YUNG CHEMICAL IND CORP0 citations39