Inventor

DING XIAOYI

US18 patents

⚠️ This page may combine multiple inventors who share the name “DING XIAOYI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DING XIAOYI

DING XIAOYI

Pressure sensor for harsh media sensing and flexible packaging

Thin semiconductor device having embedded die support and methods of making the same

Thin semiconductor device having embedded die support and methods of making the same

Thin semiconductor device having embedded die support and methods of making the same

Thin semiconductor die package

Continental automotive systems inc

Absolute pressure sensor with improved cap bonding boundary

Embedded structures for high glass strength and robust packaging

Embedded structures for high glass strength and robust packaging

Humidity resistant sensors and methods of making same

Humidity resistant sensors and methods of making same

MOTOROLA INC

Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum

Feedthrough design and method for a hermetically sealed microdevice

Wafer-level sealed microdevice having trench isolation and methods for making the same

Selectable pressure sensor

TEMIC AUTOMOTIVE NA INC

Hermetically sealed microdevice with getter shield

Wafer-level sealed microdevice having trench isolation and methods for making the same

CONTINENTAL AUTOMOTIVE SYSTEMS

Cap side bonding structure for backside absolute pressure sensors

Piezoresistive transducer with low thermal noise