P

Inventor

FANG Hsu-Nan

TW31 patents

Patents

31 patents
US11276661B2Mar 15, 2022

Package structure including two joint structures including different materials and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG14 citations85
US10593630B2Mar 17, 2020

Semiconductor package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG8 citations83
US11316274B2Apr 26, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US11139252B2Oct 5, 2021

Semiconductor package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US10886223B2Jan 5, 2021

Semiconductor package

ADVANCED SEMICONDUCTOR ENG2 citations72
US10797022B2Oct 6, 2020

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations72
US10475775B2Nov 12, 2019

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations72
US12249578B2Mar 11, 2025

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations63
US12136579B2Nov 5, 2024

Package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11710675B2Jul 25, 2023

Package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US11538778B2Dec 27, 2022

Semiconductor package including alignment material and method for manufacturing semiconductor package

ADVANCED SEMICONDUCTOR ENG1 citations62
US11282778B2Mar 22, 2022

Interposer between a conductive substrate and plurality of semiconductor components

ADVANCED SEMICONDUCTOR ENG1 citations62
US11282772B2Mar 22, 2022

Package structure, assembly structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11257776B2Feb 22, 2022

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11195771B2Dec 7, 2021

Substrate structure of semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11139268B2Oct 5, 2021

Semiconductor package structure and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US10804172B2Oct 13, 2020

Semiconductor package device with thermal conducting material for heat dissipation

ADVANCED SEMICONDUCTOR ENG1 citations62
US12165982B2Dec 10, 2024

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations61
US12142576B2Nov 12, 2024

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations61
US11791434B2Oct 17, 2023

Electronic package, optoelectronic package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations61
US11605597B2Mar 14, 2023

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations61
US11404380B2Aug 2, 2022

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations61
US11211319B2Dec 28, 2021

Device structure

ADVANCED SEMICONDUCTOR ENG1 citations60
US10943843B2Mar 9, 2021

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations59
US11217498B2Jan 4, 2022

Semiconductor package and manufacturing method of the same

ADVANCED SEMICONDUCTOR ENG0 citations57
US11133284B2Sep 28, 2021

Semiconductor package device

ADVANCED SEMICONDUCTOR ENG1 citations55
US12550654B2Feb 10, 2026

Method for manufacturing semiconductor package

ADVANCED SEMICONDUCTOR ENG0 citations51
US11502024B2Nov 15, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations51
US11257788B2Feb 22, 2022

Semiconductor device package with stacked die having traces on lateral surface

ADVANCED SEMICONDUCTOR ENG0 citations51
US10573572B2Feb 25, 2020

Electronic device and method for manufacturing a semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations47
US10797019B2Oct 6, 2020

Semiconductor package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations40