Inventor
KIM DUYEUL
KR7 patents
Patents
7 patentsUS9805769B2Oct 31, 2017
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD19 citations91
US10971208B2Apr 6, 2021
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations83
US10734059B2Aug 4, 2020
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations83
US11837273B2Dec 5, 2023
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US10418087B2Sep 17, 2019
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US11417386B2Aug 16, 2022
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11328760B2May 10, 2022
Semiconductor device having interconnection in package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61