Inventor
HUANG JEN-I
TW4 patents
⚠️ This page may combine multiple inventors who share the name “HUANG JEN-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
3 patentsUS9887148B1Feb 6, 2018
Fan-out semiconductor package structure and fabricating method
POWERTECH TECHNOLOGY INC11 citations76
US11437336B2Sep 6, 2022
Semiconductor package structure with landing pads and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations48
US12557692B2Feb 17, 2026
Semiconductor packaging assembly and semiconductor packaging structure
POWERTECH TECHNOLOGY INC0 citations46