Inventor
HUANG KUN-YUNG
TW7 patents
Patents
7 patentsUS10276545B1Apr 30, 2019
Semiconductor package and manufacturing method thereof
POWERTECH TECHNOLOGY INC19 citations77
US10177058B1Jan 8, 2019
Encapsulating composition, semiconductor package and manufacturing method thereof
POWERTECH TECHNOLOGY INC2 citations70
US11437336B2Sep 6, 2022
Semiconductor package structure with landing pads and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations48
US11289401B2Mar 29, 2022
Semiconductor package
POWERTECH TECHNOLOGY INC0 citations47
US12557692B2Feb 17, 2026
Semiconductor packaging assembly and semiconductor packaging structure
POWERTECH TECHNOLOGY INC0 citations46
US10460959B2Oct 29, 2019
Package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations37
US10607856B2Mar 31, 2020
Manufacturing method of redistribution layer
POWERTECH TECHNOLOGY INC0 citations29