Inventor
WEI YUN
US15 patents
⚠️ This page may combine multiple inventors who share the name “WEI YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
5 patentsUS11342275B2May 24, 2022
Leadless power amplifier packages including topside terminations and methods for the fabrication thereof
NXP USA INC4 citations71
US11984429B2May 14, 2024
Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof
NXP USA INC2 citations70
US11621231B2Apr 4, 2023
Methods of fabricating leadless power amplifier packages including topside terminations
NXP USA INC0 citations61
US11349438B2May 31, 2022
Power amplifier packages containing multi-path integrated passive devices
NXP USA INC0 citations50
US10608588B2Mar 31, 2020
Amplifiers and related integrated circuits
NXP USA INC0 citations30
LO3 ENERGY INC
4 patentsUS9480188B2Oct 25, 2016
Use of computationally generated thermal energy
LO3 ENERGY INC25 citations93
US11350547B2May 31, 2022
Use of computationally generated thermal energy
LO3 ENERGY INC1 citations71
US10485144B2Nov 19, 2019
Use of computationally generated thermal energy
LO3 ENERGY INC3 citations71
US12309980B2May 20, 2025
Use of computationally generated thermal energy
LO3 ENERGY INC0 citations61